Dongguan ZhongPhoenix Electronic Technology Co., Ltd.

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Smart Card Chip Bonding
  • Non-conductive Hot Melt Film 8830R-50

     

    8830R-50 is transparent polyamide hot melt film. It can be use for various kinds of materials bonding and laminating. It can provide very high adhesion strength to epoxy glass fiber sheet, metal, ABS, PVC, PC, PU, Nylon. 8830R-50 also can be used for the Smart Card Chip Bonding. It has been approved and used by the Smart Card factories.

  • Non-conductive Hot Melt Film 8835R-50

     

    8835R-50 is transparent polyamide hot melt film. It can be use for various kinds of materials bonding and laminating. It can provide very high adhesion strength to epoxy glass fiber sheet, metal, ABS, PVC, PC, PU, Nylon. 8835R-50 also can be used for the Smart Card Chip Bonding. It has been approved and used by the Smart Card factories.

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